On June 8, 2022, NIO ET5 officially landed at the Ministry of Industry and Information Technology (MIIT). ET5, scheduled to be delivered in the third quarter of this year, is not far from delivery.
In fact, in January of this year, the first batch of trial vehicles from the ET5 production line had already rolled off the assembly line in Hefei. Advancing to the MIIT signifies that the ET5 has entered the final stage of verification.
The specific information announced by the MIIT this time is as follows:
- Length/width/height: 4,790/4,913 x 19,60 x 1,499 mm;
- Wheelbase: 2,880 mm;
- Maximum speed: 200 km/h;
- Front/rear wheel tread: 1,685/1,685 mm;
- Approach/departure angle: 13/14°;
- Front/rear suspension: 897/1,005 897/1,128 mm;
- Kerb weight: 2,200/2,185/2,180/2,165/2,145 kg;
- Front/rear motor: 150/210 kW (NIO Power Technology (Hefei) Co., Ltd.).
Most of this data had already been disclosed beforehand. The NIO ET5 declared this time comes in two body sizes. From the optional equipment photos, we can see that the ET5 surprisingly has an electrically extendable trailer hitch, which caused the size increase. Trailer hitches are very common on touring cars and SUVs in Europe and the United States to pull trailers.
In recent years, with the popularity of pure electric vehicles and the increase in cruising range, the camping lifestyle has become increasingly popular. Some time ago, NIO also launched an integrated charging and discharging machine for camping to enhance everyone’s portability. In addition, the launch of the C6 driver’s license and the formalization of towing RVs and motorcycles have also begun.
By the way, if the price is right, would users choose to install the trailer hitch for their ET5?
工信部：将会同相关部门推进汽车芯片应用
近期，工业和信息化部印发了《关于加强汽车芯片应用推广的实施意见》，明确提出将继续加强与相关部门的协同合作，积极推进汽车芯片应用，打造以芯片为核心的智能化汽车产业。同时，将加强芯片设计和开发，加快形成面向车辆及交通系统的芯片产品研发、生产和应用体系，推动培育新一代信息技术产业发展，提升汽车产业水平。
为此，下一步将立足车联网、新能源汽车、智能网联汽车等重点领域，积极推动芯片产品的开发和产业化。加强与供应商和生产企业的合作，加强质量安全监管，推进芯片生产工艺和装备技术革新。同时，将大力推进车联网、自动驾驶、智能交通等技术应用，推动汽车产业与信息通信技术深度融合，打造全球领先的智能化汽车产业基地。
该文件指出，引导和支持汽车及零部件企业扩大生产规模、推动针对车辆及交通系统的芯片研发和产业化，将芯片产品应用于汽车电子、车体控制、驾驶辅助、节能与新能源等多个领域，提高车辆的智能化、安全性、节能减排等综合水平。加强基础研究、核心技术攻关和标准制定，积极推进芯片产品质量安全监管和标准化工作，强化行业自律和监管机制，不断提升芯片产业水平和汽车产业发展质量。
Original Chinese text with Markdown and HTML tags preserved:
工信部：将会同相关部门推进汽车芯片应用
近期，工业和信息化部印发了《关于加强汽车芯片应用推广的实施意见》，明确提出将继续加强与相关部门的协同合作，积极推进汽车芯片应用，打造以芯片为核心的智能化汽车产业。同时，将加强芯片设计和开发，加快形成面向车辆及交通系统的芯片产品研发、生产和应用体系，推动培育新一代信息技术产业发展，提升汽车产业水平。
为此，下一步将立足车联网、新能源汽车、智能网联汽车等重点领域，积极推动芯片产品的开发和产业化。加强与供应商和生产企业的合作，加强质量安全监管，推进芯片生产工艺和装备技术革新。同时，将大力推进车联网、自动驾驶、智能交通等技术应用，推动汽车产业与信息通信技术深度融合，打造全球领先的智能化汽车产业基地。
该文件指出，引导和支持汽车及零部件企业扩大生产规模、推动针对车辆及交通系统的芯片研发和产业化，将芯片产品应用于汽车电子、车体控制、驾驶辅助、节能与新能源等多个领域，提高车辆的智能化、安全性、节能减排等综合水平。加强基础研究、核心技术攻关和标准制定，积极推进芯片产品质量安全监管和标准化工作，强化行业自律和监管机制，不断提升芯片产业水平和汽车产业发展质量。
This article is a translation by ChatGPT of a Chinese report from 42HOW. If you have any questions about it, please email bd@42how.com.